STUDY OF GaAs SURFACE AFTER ETCHING IN PLASMA OF FREON R12 BY AFM
Keywords:
plasma etching, freon, atomic force microscopy, plasma-chemical processes, the plasma gasAbstract
Plasma etching of gallium arsenide in RF discharge in freon R-12 was carried out. It is shown that the adjustment of parameters such as the sample’s handling time and bias potential determine the quality of the future semiconductor structure. Nevertheless, samples surface quality control remains an urgent task of modern electronics. In this paper, the samples surface control was carried out by atomic force microscope Solver - P47Pro.
References
(1) Lakdawala V.K., Ko S.T., Albin S. // Bull. Am. Phys. Soc. 1988. V. 33. P.145.
(2) В.В. Пасынков, В.С. Сорокин. // Материалы электронной техники: уч. для студ. вузов по спец. электронной техники. / СПб.: Лань, 2001, C. 368.
(3) Rawal D. S., Sehgal B. K., Muralidharan R., Malik H. K. // Experimental Study of the Influence of Process Pressure and Gas Composition on GaAs Etching Characteristics in Cl2/BCl3 – Based Inductively Coupled Plasma. Plasma Science and Technology. 2011. V. 13. № 2. P. 223-229.
(4) Дунаев А.В., Пивоваренок С.А., Семенова О.А., Капинос С.П., Ефремов А.М., Светцов В.И. // Кинетика и механизмы плазмохимического травления GaAs в хлоре и хлороводороде. Физика и xимия обработки материалов. 2010, № 6, С. 42-46.
(5) Efremov A.M., Pivovarenok S.A., Svettsov V.I. // Kinetics and Mechanism of Cl2 or HCl Plasma Etching of Copper. Thin Films. 2007. V.36. №6. P. 358-365.