Production of porous nickel from Ni/Cu alloy by selective electrochemical etching
Keywords:
композиционные углерод-полимерные волокна, полиметил- метакрилат, электроспиннинг, карбонизованная рисовая шелуха.Abstract
Currently, obtaining porous frame nanostructures from conductive materials and semiconductors is an important area of nanotechnology. Porous metal structures are of growing technological interest because of the many beneficial physical properties such as low mass density, high surface area, and high mechanical strength. Porous materials also have the potential to improve electrical, thermal, optical, or reactive properties, which leads to many possible applications. Nanoporous materials have unique surface, structural, and bulk properties, leading to applications in various fields, such as ion exchange, separation, catalysis, sensors, biological molecular isolation, and purification. The work has developed methods for obtaining porous nickel frame structures by the method of selective electrochemical etching from Ni/Cu alloy. To determine the effect of the ratio of the starting components (nickel and copper) on the morphology of porous nickel after electrochemical etching, the alloys were investigated in the following ratios Ni:Cu – 90:10, 80:20, and 60:40. It was found that the ratio of nickel and copper in the composition of the original alloy affects the structure and morphology of porous nickel. To study the structure and morphology of the obtained images of porous nickel, modern analysis methods were used, such as scanning electron (scanning) microscopy and the method of low-temperature nitrogen adsorption (BET method).
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